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本帖最后由 掃街 于 2010-1-29 15:36 編輯 1 R, ], J1 p$ r
' S2 z: Q' ]1 m, Z5 u5 N: k' k% PFabrication(EBF3),電子束無模成形制造技術。是目前最為先進的直接制造技術(Direct Manufacturing),它可以從計算機3D模型直接成型出機械零件。與現有的快速成型技術(RP,rapid prototyping)不同的是,EBF3技術可以直接成型鈦(titanium)、鎳( nickel)、不銹鋼(stainless steel)和其它有較高熔點的合金(refractory alloys)零件。EBF3將改變傳統的金屬加工制造模式,隨著這一技術的進一步成熟,EBF3將首先應用于航空制造業、軍工制造業和汽車制造業,大大縮短零件制造周期,減少原材料浪費,降低成本;并且有利于太空零件加工和空間設備維修。 8 O" [$ v4 s; c6 c" U6 m
美國宇航局蘭利研究中心(NASA Langley Research Center)日前對外演示了這項新技術。據了解,NASA已經獲得了這項目技術的發明專利(#7,168,935),其它相關專利正在申請中,美國Sciaky Inc等公司為EBF3技術的合同商。
+ _2 P* T+ C* O" }9 ~% I. Q9 bEBF3,電子束無模成形系統見圖dd1 C; Q: F+ w* {" i0 E( X3 |5 V
EBF3制造出的樣件見圖ee- [( L6 p( p$ g+ O |3 r& L
EBF3真空室見圖ff
, @0 I9 l9 a& {2 u0 Q6 q0 Y+ LEBF3控制面板見圖gg
0 i+ L- J {+ R$ ~* ^2 {! ~5 AEBF3 主要技術參數
! l9 g) ]# g( z+ i8 t' P: H; h Current build volume:6 in. x 6 in. x 6 in. (15.24 cm x 15.24 cm x 15.24
$ J6 W9 v0 P3 H5 A4 @9 ncm)
+ O% \$ L/ X( G1 ` Maximum build size: 6 in. x 6 in. x 6 in. (15.24 cm x 15.24 cm x 15.24 cm)- K4 t0 n' P, [, X* r, A
Layer thickness: 0.02 in. – 0.05 in. (0.5 mm – 1.27 mm)
! v2 W- H0 @" }5 o: M% C- o3 | E-beam scan speed:Not applicable
* n8 |9 i+ N, I. N/ b6 [ Deposition rate:5 cubic in. per hour (80 cubic cm per hour)5 Y7 F9 M3 P" B! C2 M5 ?
E-beam positioning accuracy:±0.005 in. (±0.127 mm)" r/ x* F. m4 G* R1 H8 y+ w
Part accuracy:±0.1 in. (±2.54 mm) has been demonstrated, and experience
# @% m8 i8 T0 X2 P* H+ _ suggests that accuracy of ±0.05 in. (±1.27 mm) could eventually be
: E6 n/ r4 r% y achieved& [& \! g2 O+ E9 q' I$ b
Calibration:Automatic
8 V0 q% L2 t$ v1 n Cooling:Automatic8 p. E2 e: F& M. F1 t
Power supply:Max: 30 kV, 100 mA, 3 kW
! S1 k* C+ X v, i8 J: U5 B5 t Size:Standard 19-in. (48.26-cm) rack-mounted controls6 F: m4 Q& E4 J7 Z0 v" q
Chamber option 1: 32 in. W x 42 in. H x 32 in. D, }' \: p3 z. ^
(107 cm W x 107 cm H x 81 cm D)
7 K7 T9 c8 N0 \ d) k" h Chamber option 2: 24 in. diameter x 24 in. high1 A _* M: A& p4 b2 q7 z% E! c
(61 cm x 61 cm)
6 G) h# Z0 ?) w; i; H3 u Total system weight: 350 lbs. (160 kg)8 q' {4 D4 d; g/ |
Process computer:PC, XP, LabVIEW Interface
0 d& }- Q, s$ h CAD interface:Standard: STL or other engineering CAD/CAM (ProE, CATIA, f; q/ n* p- I! z3 B# u% y
FeatureCAM, MasterCAM)
6 f N& N* ^3 D! S Network:Ethernet: 10/100
2 D, q7 K5 F# X. ~" z3 f Certification:NASA’s partners are seeking aerospace certification |
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